MUBW 25-12 T7
Output Inverter T1 - T6
Equivalent Circuits for Simulation
Symbol
Conditions
Maximum Ratings
Conduction
V CES
V GES
I C25
I C80
I CM
T VJ = 25°C to 150°C
Continuous
T C = 25°C
T C = 80°C
T C = 80°C; t p = 1 ms
1200
± 20
45
25
50
V
V
A
A
A
P tot
T C = 25°C
170
W
IGBT (typ. at V GE = 15 V; T J = 125°C)
T1-T6
Symbol
Conditions
Characteristic Values
(T VJ = 25 ° C, unless otherwise specified)
min. typ. max.
T7
V 0 = 0.92 V; R 0 = 42.8 m ?
V 0 = 0.92 V; R 0 = 72 m ?
V CE(sat)
I C = 25 A; V GE = 15 V; T VJ = 25°C
T VJ = 125°C
1.7
2.0
2.15
V
V
Diode (typ. at T J = 125°C)
D1-D6
V GE(th)
I C = 1 mA; V GE = V CE
5
5.8
6.5
V
V 0 = tbd V; R 0 = tbd m ?
I CES
V CE = V CES ; V GE = 0 V; T VJ = 25°C
T VJ = 125°C
0.7
2.7
mA
mA
D7
V 0 = tbd V; R 0 = tbd m ?
I GES
C ies
Q Gon
t d(on)
t r
t d(off)
t f
E on
E off
RBSOA
I SC
(SCSOA)
V CE = 0 V; V GE = ± 20 V
V CE = 25 V; V GE = 0 V; f = 1 MHz
V CE = 600 V; V GE = 15 V; I C = 25 A
Inductive load, T VJ = 125°C
V CE = 600 V; I C = 25 A
V GE = ±15 V; R G = 36 ?
I C = I CM ; V GE = ±15 V
R G = 36 ? ; T VJ = 125°C
V CE = 720 V; V GE = ±15 V; R G = 36 ? ;
t p < 10 μs; non-repetitive; T VJ = 125°C
400
1.8
240
90
50
520
90
2.5
3.4
V CEK < V CES - L S di/dt
100
nA
nF
nC
ns
ns
ns
ns
mJ
mJ
V
A
D11-D16
V 0 = tbd V; R 0 = tbd m ?
Thermal Response
IGBT (typ.)
T1-T6
C th1 = tbd J/K; R th1 = tbd K/W
C th2 = tbd J/K; R th2 = tbd K/W
R thJC
(per IGBT)
0.73 K/W
T7
C th1 = tbd J/K; R th1 = tbd K/W
C th2 = tbd J/K; R th2 = tbd K/W
Output Inverter D1 - D6
Diode (typ.)
Symbol
Conditions
Maximum Ratings
D1-D6
C th1 = tbd J/K; R th1 = tbd K/W
I F25
I F80
T C = 25°C
T C = 80°C
25
17
A
A
D7
C th2 = tbd J/K; R th2 = tbd K/W
C th1 = tbd J/K; R th1 = tbd K/W
Symbol
Conditions
Characteristic Values
C th2 = tbd J/K; R th2 = tbd K/W
min.
typ.
max.
D11-D16
C th1 = tbd J/K; R th1 = tbd K/W
V F
I F = 25 A; V GE = 0 V; T VJ = 25°C
2.1
2.6
V
C th2 = tbd J/K; R th2 = tbd K/W
I RM
T VJ = 125°C
1.6
tbd
V
A
Q rr
t rr
I F = tbd A; di F /dt = -tbd A/μs; T VJ = 125°C
V R = 600 V; V GE = 0 V
tbd
tbd
μC
ns
E rec
R thJC
(per diode)
tbd
mJ
2.1 K/W
? 2006 IXYS All rights reserved
2-4
相关PDF资料
MUBW30-06A7 MODULE IGBT CBI E2
MUBW30-12A6 MODULE IGBT CBI E1
MUBW35-06A6 MODULE IGBT CBI E1
MUBW35-12A7 MODULE IGBT CBI E2
MUBW35-12A8 MODULE IGBT CBI E3
MUBW40-12T7 MODULE IGBT CBI E2
MUBW45-12T6K MODULE IGBT CBI E1
MUBW50-06A7 MODULE IGBT CBI E2
相关代理商/技术参数
MUBW30-06A7 功能描述:分立半导体模块 30 Amps 600V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW30-12A6 功能描述:MODULE IGBT CBI E1 RoHS:是 类别:半导体模块 >> IGBT 系列:- 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
MUBW30-12A6K 功能描述:分立半导体模块 30 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW30-12E6K 功能描述:分立半导体模块 30 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-06A6 功能描述:MODULE IGBT CBI E1 RoHS:是 类别:半导体模块 >> IGBT 系列:- 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
MUBW35-06A6K 功能描述:分立半导体模块 35 Amps 600V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-12A7 功能描述:分立半导体模块 35 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-12A8 功能描述:分立半导体模块 35 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装: